Infinix Launches 3D Vapour Cloud Chamber Liquid Cooling Technology

Today, Infinix officially launched its revolutionary 3D Vapor Cloud Chamber (3D VCC) Liquid Cooling Technology. Using innovative design on the dimensionality of VC shape for the first time, designers have achieved an increase in the chamber volume which significantly improves heat dissipation resulting in better performance.

This creative solution fixes some issues caused by high temperatures for high-integration and high-power smartphones, such as CPU frequency reduction, frame rate drops, and frozen screens. This new technology has been certified by the China National Intellectual Property Administration.

Infinix  3D VCC

How Infinix’s Self-Developed 3D VCC Technology Works

When heat enters the VC, water in the evaporator is vaporized into steam, which removes excess heat. Hot steam then flows into the condenser becoming a liquid, which flows back to the evaporator through the internal wick structure that forms a hot and cold circulation system with the coexistence of water and steam.

When compared with traditional VC design, the 3D Vapor Cloud Chamber Liquid Cooling Technology has come a long way forward. Bumps were added to one side of the evaporator, increasing chamber volume and water storage capacity along with thermal flux. Water injection volume and Q max values increased by 20% when compared with conventional VC[1] resulting in massive improvements overall.

Infinix 3D VCC

With this technology embedded into Infinix smartphones, users can enjoy the benefit of superior performance when their device is under heavy load, allowing them to play games harder and faster, live-stream for longer and reap the rewards of a cooler, smoother running high performance smartphone.

Following its motto of “The Future is Now”, Infinix will continue to develop its smartphone heat dissipation technology. Infinix will develop thinner VCs with more bumps, with more creative material processes, and even merge the smartphone middle frame and 3D VCC into one, or to miniaturize the entire computer cooling module into the smartphone.

Spread the love

Leave a Comment